Wafer Bonding and Debonding Equipments

• Up to 400 ℃ Bonding Temperature
• Both Top and Bottom Heating
• Up to 1000 Kg Bonding Force
• Vacuum down to 10-6 Torr
• Bonding TTV less than 3 um
• SiC Bonding Plates

• Compatible with 4 inch and 6 inch wafer as well
• Air Assisted Mechanical Debonding
• Debonding at Room Temperature
• Automated Debonding Interface Recogination
• Controlled Air Jetting
• Automated Carrier Unloading
• Minimized Debonding Force on Wafer

• 12 inch wafer debonding
• Debonding at Room Temperature
• Four Air Jetting Nozzles
• Independently Controlled Air Jetting Action
• Automated Carrier Unloading
• Minimized Debonding Force on Wafer

Micro Materials Inc. has proudly been serving our community of friends and neighbors worldwide since 2014. We feature patented technology that will revolutionize the way you do business. We believe in an open line of communication to discuss how our patented technology can work for your company. Our team of experts put care and effort into the innovation of our equipment.

By partnering with specialists in their field, we believe we can pioneer the industry. Each development stage is given careful consideration to ensure our patented technology stands out from the competition. We’re committed to your success. You’re one fine part away from meeting your business bottom line. Our professional staff is America’s top wafer innovators. We believe in making technology work for you.