Wafer Coating Material, Bonding Adhesive and Cleaning Agents
Materials
Our team of experts are known for our improvement solutions that’s patented into each part. There’s a lot of new technology in the semiconductor network. Do you know what parts your business needs to be productive? We believe in the functionality of our parts.
- Z-COAT 008 – Temporary Bonding Adhesive (stable up to 270 ℃)
- Z-COAT 100 – Wafer Surface/Bump Protection Film (water soluble)
- Z-COAT 110 – Aqueous Temporary Bonding Adhesive (stable up to 270°C)
- Z-COAT 122B – Wafer Surface/Bump Protection Film (water resistant)
- Z-COAT 211 – Liquid Polyimide Coating (stable up to 400 °C)
- Z-COAT 401 – Wafer Temporary Bonding Adhesive (stable up to 270°C)
- Z-COAT 451 – Temporary Wafer Bonding Adhesive (stable up to 450 °C)
- Z-CLEAN 820C – Aqueous Cleaner/ Photoresist Stripper
- Z-CLEAN 910 – Bonding Adhesive Remover
- Z-CLEAN 930 – Bonding Adhesive Remover
Connect!
Why Is An Innovative Wafer Conducive For Business? Wafer innovation can secure your protection and be a consistent automated interface. Reduce backside contamination with a wafer that is expertly designed to simplify and ensure a commitment to the highest in industry parts.
A professional understands wafer transfer is an important part of the front-end process for the semiconductor equipment. In a competitive industry, you have to simplify the process while enhancing your networking with professionals with the key parts your business needs.