Semiconductor Wafer Temporary Bonding Debonding and Device Temporary Protection Specialist

Enable advanced thin semiconductor manufacturing with higher yield and reduced cost.

Our breakthrough AirDebond® technology enables wafer stacks to be debonded with extremely low-stress air jetting, giving our customers a cleaner, greener, and faster thin wafer handling experience. Best of all, AirDebond® technology requires no physical contact with the wafer and bonding adhesive during the entire debonding process, maximizing the protection of our customers’ valuable wafers.

Helpful PDF’s:

• Air Jetting Debonding for Thin-Wafer/Panel and Fan-Out Wafer-Level Package Processing
• High Throughput Air Jetting Wafer Debonding for 3D IC and MEMS Manufacturing
• High Throughput Low-Stress Air Jetting Carrier Release for RDL-First Fan-Out Wafer-Level-Packaging

MMI’s AirDebond® technology integrates wafer bonding, wafer debonding, adhesives, and cleaners into one cohesive solution for thin wafer processing. It requires low temperature (around 110 °C) wafer bonding and room temperature instant mechanical debonding. The bonded wafer stack can be controlled to less than 3 um total thickness variation (TTV) and can withstand fabrication processing temperatures of up to 350 °C. Furthermore, AirDebond® technology debonds wafer from stacks in less than one minute.

Micro Materials Inc. (MMI) patented air assisted mechanical debonding (AirDebond) enables ZERO peeling stress on device wafer (10 um thickness capable) debonding with ultra high lifting force on carrier.

MMI also provides high temperature temporary adhesive and protective coating for semiconductor wafer dicing protection and process yield improvement. The innovative technology has been widely used in the field of thin compound semiconductor, advanced IC packaging, photonics packaging, glass substrate processing, MEMS manufacturing, CMOS image sensor backend processing and flexible electronics fabrication etc.

MMI has a full set of application and service capability in house. Customer can evaluate the equipment, material and all processing aspects one-stop at MMI.

The semiconductor manufacturing process can be imperative to the task at hand. The entire robotic system should facilitate and automate the semiconductor manufacturing process to improve efficiency. There’s always the need for the right parts to keep the system fully functional to avoid costly downtime. The productivity of your system is equally important.

The industry’s top parts are highly preferred among company executives and fast-moving market professionals. If your business is in the market for quality parts, understanding the fundamentals of the unique parts can give it a competitive edge. Learn the benefits of expert wafer innovation to streamline your company.